3D-ICs.com Adopts Advertising Model
San Jose, California (PRWEB) November 30, 2011 3D-ICs.com, the premier internet portal aggregating 3D semiconductor technology news, blogs and technical papers, announced that beginning in January, 2012, it will offer advertising opportunities to companies specializing in 3D IC, 3D packaging, and TSV related products and services.
3D integration is in its early stages of market adoption, with high volume manufacturing expected to ramp up in the next few years. According to research from Yole D?veloppement , the market for 3D TSV packaging will increase from $ 325M in 2009 to $ 4.1B in 2015, a cumulative annual growth rate (CAGR) of 53%. In addition, players in the memory industry, such as Toshiba, Samsung, Micron and Hynix, are actively exploring monolithic 3D approaches to NAND flash memory, with risk production scheduled to begin in the next 3 years.
As IDMs, foundries and OSATs begin to add capacity for 3D IC processes; the market is ripe for vendors of 3D related to...